Abstract: Copper slag,as a solid waste generated during the copper smelting process,is often stacked,occupying land resources and polluting the environment.Its resource utilization is increasingly receiving widespread attention in China and overseas.To solve this problem,the infrared radiation coating was prepared at 1 200 ℃ with copper slag as the main raw material,terpineol as the film forming agent,ethyl cellulose as the thickening agent,and high alumina bricks as the substrate material of the infrared radiation coating.Effects of the heat treatment time (0.5,2, 4,and 8 h) on the microstructure and emissivity at room temperature and 400 ℃ were studied.The results show that the coating is well combined with the high alumina brick substrate,with heat treatment time prolonging, the coating gradually becomes dense;after heat treatment at 1 200 ℃ for 8 h,the near-infrared (0.8-2.5 μm) emissivity of the coating reaches the maximum (0.862);after heat treatment for 4 h,the emissivity increases and reaches the maximum (0.928) after heat treatment in the mid-infrared (2.5-25 μm) wave range;after heat treatment for different times,the emissivity of the coating fired at 400 ℃ in 1-22 μm wave range increases continually and is higher than 0.93.Combined with practical applications,the optimal heat treatment time is 4 h.

Key words: copper slag, infrared radiation coating, heat treatment time, emissivity

摘要： 铜渣作为炼铜产生的固体废弃物,常被堆放占用土地资源,并且污染环境,其资源化利用日益受到国内外广泛关注。针对此问题,以铜渣为主要原料,松油醇为成膜剂,乙基纤维素为增稠剂,高铝砖为红外辐射涂层基底材料,于1 200 ℃热处理后制备了红外辐射涂层,研究了热处理时间(0.5、2、4和8 h)对涂层显微结构以及其分别在常温和400 ℃下发射率的影响。结果表明,涂层与高铝砖基底结合良好,且随着热处理时间的延长,涂层逐渐致密;涂层在1 200 ℃热处理8 h后,其在常温下近红外波段(0.8~2.5 μm)的发射率最高,为 0.862;热处理4 h后,涂层在使用更为广泛的中红外波段(2.5~25 μm)的发射率最高,为0.928;涂层经不同时间热处理后,在400 ℃下1~22 μm波段的发射率不断增大且全部大于0.93。结合实际应用,最佳热处理时间为4 h。

关键词: 铜渣, 红外辐射涂层, 热处理时间, 发射率